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85
Voted
CASES
2010
ACM
14 years 7 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
69
Voted
CORR
2008
Springer
14 years 9 months ago
2008
Springer
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
CLEIEJ
2010
14 years 7 months ago
2010
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
SLIP
2009
ACM
15 years 4 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...