1476 search results - page 102 / 296 » Three-dimensional integrated circuits |
ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
ISCAS
1999
IEEE
15 years 4 months ago
1999
IEEE
Current mode (ECL) logic has long been the option of choice in those applications requiring logic functions at multigigahertz rates. This trend continues despite the obvious very ...
VTS
2006
IEEE
15 years 6 months ago
2006
IEEE
This paper presents the design and experimental results of fully integrated CMOS power sensors for RF built-in self-test (BIST) applications. Using a standard 0.18- m CMOS process...
ITC
2000
IEEE
15 years 4 months ago
2000
IEEE
An area efficient and robust integrated test core for mixed-signal circuits is described. The core consists of a completely digital implementation, except for a simple reconstructi...
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Voted
ICCAD
1998
IEEE
15 years 4 months ago
1998
IEEE
Combinational verification is an important piece of most equivalence checking tools. In the recent past, many combinational verification algorithms have appeared in the literature...