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DAC
2007
ACM
16 years 4 days ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
DAC
2007
ACM
16 years 4 days ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
106
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DAC
2007
ACM
16 years 4 days ago
2007
ACM
The memory hierarchy of a system can consume up to 50% of microprocessor system power. Previous work has shown that tuning a configurable cache to a particular application can red...
DAC
2007
ACM
16 years 4 days ago
2007
ACM
Many STUMPS architectures found in current chip designs allow disabling of individual scan chains for debug and diagnosis. In a recent paper it has been shown that this feature can...
DAC
2007
ACM
16 years 4 days ago
2007
ACM
A key step in the design of cyclo-static real-time systems is the determination of buffer capacities. In our multi-processor system, we apply back-pressure, which means that tasks...