ÑIn this paper, we present a comparative study on the effects of resistive-bridging defects in the SRAM core-cells, considering different technology nodes. In particular, we analy...
Renan Alves Fonseca, Luigi Dilillo, Alberto Bosio,...
For obtaining a zero defect level, a high fault coverage with respect to the stuck-at fault model is often not sufficient as there are many defects that show a more complex behavi...
Real defects (e.g. stuck-at or bridging faults) in the VLSI circuits cause intermediate voltages and can not be modeled as ideal shorts. In this paper we first show that the trad...
Loical defect diagnosis is a critical yet challenging process in VLSI manufacturing. It involves the identification of the defect spots in a logic IC that fails testing. In the la...
The advantage to “one test at a time” fault diagnosis is its ability to implicate the components of complicated defect behaviors. The disadvantage is the large size and opacit...