— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
- We propose a novel oscillation ring (OR) test architecture for testing interconnects in SoC. In addition to stuck-at and open faults, this scheme can detect delay faults and cr...
Katherine Shu-Min Li, Chung-Len Lee, Chauchin Su, ...
– We propose an interconnect diagnosis scheme based on Oscillation Ring test methodology for SOC design with heterogeneous cores. The target fault models are delay faults and cro...
Katherine Shu-Min Li, Yao-Wen Chang, Chauchin Su, ...
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
We present an efficient built-in self-test (BIST) architecture for testing and diagnosing stuck-at faults, delay faults, and bridging faults in FPGA interconnect resources. The BIS...