30 search results - page 2 / 6 » Temperature- and Cost-Aware Design of 3D Multiprocessor Arch... |
DAC
2010
ACM
13 years 8 months ago
2010
ACM
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ICCD
2007
IEEE
14 years 1 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
VLSID
2010
IEEE
13 years 8 months ago
2010
IEEE
Network-on-Chip combined with Globally Asynchronous Locally Synchronous paradigm is a promising architecture for easy IP integration and utilization with multiple voltage levels. ...