166 search results - page 2 / 34 » Through Silicon Vias as Enablers for 3D Systems |
DATE
2009
IEEE
14 years 11 days ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
3DIC
2009
IEEE
14 years 13 days ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
ICCAD
2009
IEEE
13 years 3 months ago
2009
IEEE
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
VLSI
2010
Springer
13 years 4 months ago
2010
Springer
—This paper proposes a novel technique to exploit the high bandwidth offered by through silicon vias (TSVs). In the proposed approach, synchronous parallel 3D links are replaced ...