SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
MOBICOM
2009
ACM
13 years 11 months ago
2009
ACM
This paper describes an unconventional way to apply wireless networking in emerging technologies. It makes the case for using a two-tier hybrid wireless/wired architecture to inte...
NOCS
2009
IEEE
13 years 11 months ago
2009
IEEE
Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a promising solution to simpli...
HPDC
2009
IEEE
13 years 11 months ago
2009
IEEE
Long running High Performance Computing (HPC) applications at scale must be able to tolerate inevitable faults if they are to harness current and future HPC systems. Message Passi...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—This paper presents an accurate interconnect thermal model for analyzing the temperature distribution of an on-chip interconnect wire. The model addresses the ambient te...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract— In many current SoCs, the architectural interface to onchip monitors is ad hoc and inefficient. In this paper, a new architectural approach which advocates the use of a...
CISIS
2009
IEEE
2009
IEEE
Designing Regular Network-on-Chip Topologies under Technology, Architecture and Software Constraints
13 years 11 months ago
—Regular multi-core processors are appearing in the embedded system market as high performance software programmable solutions. The use of regular interconnect fabrics for them a...