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    Nickel-palladium bond pads for copper wire bonding
    14 years 10 months ago
    Nickel-palladium bond pads for copper wire bonding
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    Horst Clauberg, Petra Backus, Bob Chylak
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    MR
    2011
    299views Robotics» more  MR 2011»
    Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process
    14 years 10 months ago
    Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process
    Download  www.ics.ee.nctu.edu.tw
    Yi-Hsin Weng, Hui-Wen Tsai, Ming-Dou Ker
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