FPT
2005
IEEE
13 years 10 months ago
2005
IEEE
Producing a functionally correct integrated circuit is becoming increasingly difficult. No matter how careful a designer is, there will always be integrated circuits that are fabr...
GLVLSI
2006
IEEE
13 years 10 months ago
2006
IEEE
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
CIMCA
2006
IEEE
13 years 10 months ago
2006
IEEE
This paper describes an innovative work for nanorobot design and manufacturing, using a computer simulation and system on chip prototyping approach. The use of CMOS as integrated ...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
The use of CMOS nanometer technologies at 65 nm and below will pose serious challenges on the design of mixed-signal integrated systems in the very near future. Rising design comp...
DAC
2002
ACM
14 years 5 months ago
2002
ACM
In this paper, a new type of Petri net called Hierarchical Colored Hardware Petri net, to model real-delay switching activity for power estimation is proposed. The logic circuit i...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...