ISLPED
2007
ACM
13 years 6 months ago
2007
ACM
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
ISLPED
2007
ACM
13 years 6 months ago
2007
ACM
Increasing power density in computing systems from laptops to servers has spurred interest in dynamic thermal management. Based on the success of dynamic voltage and frequency sca...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
FPL
2006
Springer
13 years 8 months ago
2006
Springer
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
DATE
2004
IEEE
13 years 8 months ago
2004
IEEE
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...
ASPDAC
2006
ACM
13 years 8 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
HAPTICS
2007
IEEE
13 years 9 months ago
2007
IEEE
In this paper, a numerical model of the thermal process of touching an object is described. The model takes into account the object geometry and temperature, the thermal parameter...
EXPCS
2007
13 years 9 months ago
2007
The modeling of power and thermal behavior of processors requires challenging validation processes, which may be complex and undependable. In order to ameliorate some of the diffi...
CASES
2007
ACM
13 years 9 months ago
2007
ACM
We derive analytically, the performance optimal throttling curve for a processor under thermal constraints for a given task sequence. We found that keeping the chip temperature co...
NANONET
2009
Springer
13 years 9 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...