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    89
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    A MEMS-based wireless multisensor module for environmental monitoring
    15 years 13 days ago
    A MEMS-based wireless multisensor module for environmental monitoring
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    Mathieu Hautefeuille, Conor O'Mahony, Brendan O'Fl...
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    82
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    Stress intensities at the triple junction of a multilevel thin film package
    14 years 12 months ago
    Stress intensities at the triple junction of a multilevel thin film package
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    Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For th...
    Insu Jeon, Ki-Ju Kang, Seyoung Im
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    73
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    Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
    14 years 12 months ago
    Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
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    This research deals with the experimental assessment of the strength of bi-material interfaces as a function of mode mixity, focusing on two dimensional problems. A modified mixed...
    J. Thijsse, Olaf van der Sluis, J. A. W. van Domme...
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    83
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    2008
    86views Robotics» more  MR 2008»
    Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
    14 years 12 months ago
    Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
    Download  npil.kaist.ac.kr
    The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...
    J. S. Hwang, M. J. Yim, K. W. Paik
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    74
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    2008
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    Dependency of thermal spreading resistance on convective heat transfer coefficient
    15 years 13 days ago
    Dependency of thermal spreading resistance on convective heat transfer coefficient
    Download  escher.elis.ugent.be
    This paper presents a study of the thermal spreading resistance Rth of a small heat source on a conductive substrate subject to bottomside convective cooling. This problem has bee...
    Bjorn Vermeersch, Gilbert De Mey
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