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ICCD
2004
IEEE
119views Hardware» more  ICCD 2004»
15 years 5 months ago
I/O Clustering in Design Cost and Performance Optimization for Flip-Chip Design
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
ICCD
2004
IEEE
172views Hardware» more  ICCD 2004»
15 years 5 months ago
A Signal Integrity Test Bed for PCB Buses
Research in high-speed interconnect requires physical test to validate circuit models and design assumptions. At multi-Gbit/sec rates, physical implementations require custom circ...
Jihong Ren, Mark R. Greenstreet
ICCD
2004
IEEE
97views Hardware» more  ICCD 2004»
15 years 5 months ago
A General Post-Processing Approach to Leakage Current Reduction in SRAM-Based FPGAs
A negative effect of ever-shrinking supply and threshold voltages is the larger percentage of total power consumption that comes from leakage current. Several techniques have been...
John Lach, Jason Brandon, Kevin Skadron
ICCD
2004
IEEE
154views Hardware» more  ICCD 2004»
15 years 5 months ago
Transistor and Pin Reordering for Gate Oxide Leakage Reduction in Dual T{ox} Circuits
Gate oxide tunneling current (Igate) is emerging as a key roadblock for device scaling in nanometer-scale CMOS circuits. A practical means to reduce Igate is to leverage dual Tox ...
Anup Kumar Sultania, Dennis Sylvester, Sachin S. S...
ICCD
2004
IEEE
98views Hardware» more  ICCD 2004»
15 years 5 months ago
Thermal-Aware IP Virtualization and Placement for Networks-on-Chip Architecture
Networks-on-Chip (NoC), a new SoC paradigm, has been proposed as a solution to mitigate complex on-chip interconnect problems. NoC architecture consists of a collection of IP core...
Wei-Lun Hung, Charles Addo-Quaye, Theo Theocharide...
Hardware
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