DFT
13 years 10 months ago
2004 IEEE 
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
DFT
13 years 10 months ago
2004 IEEE 
Reliability and manufacturing costs due to defects is a significant problem with image sensors and the ability to recover from a fault would alleviate some of these costs. A fault...
DFT
13 years 10 months ago
2004 IEEE
Defect tolerance is an extremely important aspect in nano-scale electronics as the bottom-up selfassembly fabrication process results in a significantly higher defect density comp...
DFT
13 years 10 months ago
2004 IEEE
We present a model for computing the probability of a parametric failure due to a spot defect. The analysis is based on electromigration in conductors under unidirectional current...
DFT
13 years 10 months ago
2004 IEEE 
This paper addresses the problem of test response compaction. In order to maximize compaction ratio, a single-output encoder based on check matrix of a (n, n1, m, 3) convolutional...
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