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ISPD
2006
ACM
175views Hardware» more  ISPD 2006»
15 years 2 months ago
mPL6: enhanced multilevel mixed-size placement
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
ISPD
2006
ACM
158views Hardware» more  ISPD 2006»
15 years 2 months ago
Effective linear programming based placement methods
Linear programming (LP) based methods are attractive for solving the placement problem because of their ability to model Half-Perimeter Wirelength (HPWL) and timing. However, it h...
Sherief Reda, Amit Chowdhary
ISPD
2006
ACM
156views Hardware» more  ISPD 2006»
15 years 2 months ago
Improved method of cell placement with symmetry constraints for analog IC layout design
Shinichi Kouda, Chikaaki Kodama, Kunihiro Fujiyosh...
ISPD
2006
ACM
151views Hardware» more  ISPD 2006»
15 years 2 months ago
Robust extraction of spatial correlation
Jinjun Xiong, Vladimir Zolotov, Lei He
ISPD
2006
ACM
126views Hardware» more  ISPD 2006»
15 years 2 months ago
Noise driven in-package decoupling capacitor optimization for power integrity
The existing decoupling capacitance optimization approaches meet constraints on input impedance for package. In this paper, we show that using impedance as constraints leads to la...
Jun Chen, Lei He
Hardware
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